Apple's next generation AirPods, rumored to arrive as early as late 2019, may feature a new internal design, reports DigiTimes.AirPods 3 - reportedly to hit the market by the end of 2019 - may feature a brand-new internal design adopting SiP (system in package) technology instead of rigid-flex board combination, the sources said.
A system in package design integrates a number of circuits in a single chip package, potentially saving space and reducing complexity.
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